We provide a device that uses X-rays to penetrate materials for non-destructive inspection. It is primarily used to observe internal structures and evaluate soldering quality, and is commonly applied in semiconductors, SMT, electronic components, batteries, and more.

• Non-destructive inspection: Enables internal examination without disassembling or damaging the product.
• High penetration and high resolution: Clearly reveals solder joints and internal defects such as voids, cracks, and short circuits under BGA, CSP, and other packages.
• Fast automatic detection: With AI or image analysis software, defects can be automatically identified, improving inspection efficiency and consistency.
• Multi-angle or 3D (CT) viewing: Advanced models support angled views or computed tomography (CT) scans for comprehensive 3D structure analysis.
• Wide range of applications: Ideal for high-reliability products such as electronic packaging, lithium batteries, LED modules, ceramic substrates, and automotive electronics.