A key component of automated handling systems in semiconductor manufacturing, primarily used for vacuum suction of wafers, chips, or components to assist with transfer, alignment, and placement tasks.

• High Precision and Stability: Ensures components are transported without slipping or damage.
• Diverse Materials: Available in ceramic, metal, and non-stick materials such as POM or PEEK, depending on the application.
• Customizable Apertures and Shapes: Designed to accommodate various chip sizes and geometries.
• Wear and Heat Resistance: Suitable for high-speed handling and demanding process environments.